| abstract |
According to one embodiment of the present disclosure, a method of passivating a circuit device generally includes providing a substrate having a substrate surface, forming an electrical component on the substrate surface, and first protecting the substrate surface and the electrical component. Coating with a dielectric layer. The first protective dielectric layer has a moisture permeability of less than 0.01 g / m 2 / day, a moisture absorption of less than 0.04%, a dielectric constant of less than 10, a dielectric loss of less than 0.005, a breakdown voltage strength of greater than 8,000,000 V / cm, 10 15 Ωcm Overall moisture insoluble material with greater sheet resistance, and a defect density less than 0.5 / cm 2 .n n n n Protective dielectric layer, coating, deposition, parylene, moisture permeability, moisture absorption, dielectric constant, dielectric loss |