| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6038f17109882ad88e9ba8ea907ebb45 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-124 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C22-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C9-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-282
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F11-149 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F11-00 |
| filingDate |
2008-05-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b7b84881c2d4adde6ff55ec7e34d4265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2fb7b83cb007f0bdb4b51f348d77542f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_213e5ab3962e469bb2faa08f8bc83cb9 |
| publicationDate |
2010-02-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20100014302-A |
| titleOfInvention |
Copper Surface Treatments and Surface Treatment Methods |
| abstract |
The present invention provides a copper surface treatment agent and a surface treatment method capable of satisfying both heat resistance and solderability. In the copper surface treatment agent containing an acid, a benzimidazole compound, and water, in the copper surface treatment agent of this invention, melting | fusing point is 70 degreeC than a 1st benzimidazole compound and this 1st benzimidazole compound as said benzimidazole compound. It is characterized by including at least the 2nd benzimidazole compound low at least. |
| priorityDate |
2007-06-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |