| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c16d2144a81bfa32a665dca1e93c3d37 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-73
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32245
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-48 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00 |
| filingDate |
2009-02-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c0d9706892c72c7d93fed466bb5b6a22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_925c810b9749c98d5a8958c62830b386
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_733bb79f2686be5bf92c13b8b93856b8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f9851dc017111a12ab1bd598014e6232
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_85915becad0c4b221df51ba6e29a4576
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3ee6e70a95c064dc6e8786ff37f98b8e |
| publicationDate |
2010-01-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20100006104-A |
| titleOfInvention |
Semiconductor package |
| abstract |
The present invention relates to a semiconductor package, and more particularly, a semiconductor chip having a first surface and a second surface facing the first surface and on which a semiconductor element is formed; A bonding pad provided on the second surface; And a metal ion blocking layer provided on the first surface and capable of blocking the transfer of metal through the first surface. The semiconductor package of the present invention has the effect of minimizing hygroscopicity and effectively blocking the penetration of metal ions to obtain an excellent semiconductor device. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11600523-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101350289-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11569143-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020017692-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110494964-A |
| priorityDate |
2008-07-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |