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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N60-80
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N60-0632
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L39-02
filingDate 2009-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_13da867381a25b88ed8410d8817c3413
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f56f54d241591e2ee7db26859cad1cc9
publicationDate 2009-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20090125707-A
titleOfInvention Method for manufacturing molded substrate for superconducting wire and superconducting wire using the substrate
abstract The present invention is a method of manufacturing a molded substrate used for the production of superconducting wire, and the method can deform an aggregated substrate on which an aggregated buffer layer is already grown.n n n Texture, superconducting wire, buffer layer, molded substrate, epitaxial growth, template
priorityDate 2008-06-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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