http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20090120636-A

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inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d6a2fb26f719606828f0eb71c1d6f1cc
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publicationDate 2009-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20090120636-A
titleOfInvention Method of measuring thickness of polymer resin insulator film on bonding wire surface
abstract The present invention relates to a method for measuring the thickness of a polymer resin insulating film on the surface of a bonding wire, and more specifically, to a thickness of the polymer resin insulator film coated on the surface of a bonding wire through a dipping process. Recoating a metal conductive film on the surface of the polymer resin insulator membrane by ion beam sputtering method (IBS) to protect the polymer resin insulator film and distinguishing contrast when measured by transmission electron microscope, and ion focusing beam method (FIB) And a sample for a transmission electron microscope (TEM), and then measuring the thickness and analyzing the uniformity of the polymer resin insulator film on the surface of the bonding wire using the transmission electron microscope (TEM).
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