| abstract |
In the present invention, the catalyst adhesion is good, and in the catalyst deposition step, the development step, and other steps, the catalyst adhesion layer is not peeled from the non-conductive substrate or eluted into the plating solution, and the interface of the plating layer with the catalyst adhesion layer is An object of the present invention is to provide an electroless plating forming material which does not discolor.n n n MEANS TO SOLVE THE PROBLEM In order to solve the said subject, in this electroless plating forming material which has a catalyst adhesion layer on a nonelectroconductive base material, the said catalyst adhesion layer contains a water-insoluble polyester resin, and also the pure water of the surface of the said catalyst adhesion layer Characterized in that the contact angle with respect to 60 degrees or less. |