Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0c468e687b43595cae7cb1c2667678f1 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-205 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C30B25-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-4583 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-68735 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6875 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-205 |
filingDate |
2009-04-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1f91c445131c384170d6232286a956ca |
publicationDate |
2009-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
KR-20090115663-A |
titleOfInvention |
Susceptor, semiconductor manufacturing device and semiconductor manufacturing method |
abstract |
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a susceptor, a semiconductor manufacturing apparatus, and a semiconductor manufacturing method, wherein a susceptor includes a first end for installing a wafer and a susceptor having a convex portion at a bottom of the first end, the top surface of the convex portion. In the state where the wafer is installed, a gap is formed between the top surface of the convex portion and the back surface of the wafer. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111066138-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111066138-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20150093495-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20130094601-A |
priorityDate |
2008-05-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |