abstract |
The present invention proposes a semiconductor device having a structure that can be mounted on a wiring substrate in a semiconductor device formed on a thin film substrate, a film substrate, or a sheet substrate. Moreover, this invention proposes the manufacturing method of the semiconductor device which can raise the reliability about mounting on a wiring board. One feature of the present invention is to adhere a semiconductor element formed on an insulating substrate to a member having a conductive film with a medium having anisotropic conductivity. |