http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20090112401-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a16f72268f5a1eb4f08073323a474668 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4867 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-324 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-185 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-324 |
| filingDate | 2008-04-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_848af3c253dc70c953c8f056b1df8e49 |
| publicationDate | 2009-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20090112401-A |
| titleOfInvention | Method of manufacturing substrate for semiconductor device and substrate for semiconductor device manufactured thereby |
| abstract | According to the present invention, in forming a conductive layer on a substrate, in forming an insulating layer for preventing short circuits between the conductive layers, and the like, a plurality of the substrates are stacked. It provides a manufacturing method and a substrate produced thereby. Therefore, the thermal curing is not performed to solve environmental problems due to evaporation of the organic solvent, and it is possible to improve the warpage of the substrate by reducing residual stress. |
| priorityDate | 2008-04-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 126.