http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20090110712-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b31896b0595e5629c470c80b74b2d2e4 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32134 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28 |
| filingDate | 2008-04-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9844ee5760e01f1d422976abf61fa60c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c1696bbcc172f93d6c7ad4fdd1e25740 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c3042e69c1b85ff7a6663ffc0df295ad http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_15e5bb14563a5d093ac8708e52cdaa59 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cb14d45f7dc36434887e3fc322abc7df http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cccbd64cc8c28428b66770f6e09dc244 |
| publicationDate | 2009-10-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20090110712-A |
| titleOfInvention | Method of forming through electrode using aluminum foil |
| abstract | The present invention relates to a method of forming a through-type electrode using aluminum foil, the method of forming a through-type electrode according to the present invention comprises the steps of: forming at least one through-hole having a predetermined pattern in a substrate; Attaching a zinc foil treated with zincate to one surface of the substrate to form a seed layer; Filling the at least one through hole with a conductive material using the seed layer to form a through electrode; Removing the seed layer. According to the present invention, the vacuum deposition process can be removed and the process can be performed only by the etching process, thereby simplifying the process and reducing the time of the manufacturing process, thereby reducing the overall process cost (manufacturing cost). In addition, it is possible to additionally obtain the effect of improving the electrical properties by increasing the filling rate of the through-hole electrode by suppressing the generation of voids in the initial plating process, which was a problem when using a conventional sputter seed. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20200062001-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-101976612-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017155310-A1 |
| priorityDate | 2008-04-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 33.