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filingDate 2008-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2009-10-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20090105775-A
titleOfInvention Method for forming metal layer of substrate etching part and substrate and structure having metal layer formed using same
abstract The present invention provides a method of forming a metal layer on an etching portion of a substrate. Specifically, the method of forming a metal layer in the etching portion of the substrate, etching the substrate to form an etching portion having a vertical plane, forming a diffusion material layer on the surface of the etching portion, heat treatment of the diffusion material layer, a part of the Forming a seed layer diffused below the surface of the etch, and forming a metal layer on the seed layer. According to the above method, since the surface characteristics of the substrate etching portion are improved by the seed layer, a metal layer having excellent adhesion and a uniform thickness can be formed on the vertical surface of the etching portion.n n n n Substrate, Etch, Metal Layer, Scallop, DRIE, Heat Treated, Diffusion
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20190041982-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20200105978-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20180005718-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20180136576-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20200010579-A
priorityDate 2008-04-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 38.