| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_cd7571c3ca18e1bd302b88246e1e381b |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-351
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83192
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L33-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-28 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L33-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate |
2008-04-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4db1addc79a114b993b574b8570bb607
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b9aec2bf37556d145c6b974224175625
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cc9d57a2211e365a1cce60b24f6dc101
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_530fb45cd7372ab15a3aa8aa0ceff787
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_280d872f8d46c2e0af1b924e1ace2b87
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_923e6adf383cb812113513d19e54fad8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_57bf7ee611a1162eeb5dbd4024f4dd6b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8aa1e811f0c23dcdb7ccd95ec419dc85 |
| publicationDate |
2009-10-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20090105488-A |
| titleOfInvention |
Underfill resin composition with ferroelectric filler added, semiconductor package and semiconductor packaging method using same |
| abstract |
The present invention relates to a flip chip semiconductor packaging process and an underfill resin composition used therein.n n n According to the present invention, there is provided a method of packaging a semiconductor by flip-chip, comprising: (a) applying an underfill resin containing a filler coated with a ferroelectric material to a substrate; (b) aligning the semiconductor chip on which the bump electrode is formed on the substrate and pressing the semiconductor chip so that the bump electrode is in contact with the electrode pad of the substrate; (c) interposing the pressed substrate and the semiconductor chip and applying a current to a jig in which a pattern of the semiconductor chip and an electrode having a pattern corresponding to the substrate are formed; And (d) a main compression step of hardening the underfill resin by applying heat and pressure. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20160004106-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11646155-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2021304963-A1 |
| priorityDate |
2008-04-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |