http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20090103736-A

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filingDate 2009-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2009-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20090103736-A
titleOfInvention Semiconductor device and method for manufacturing semiconductor device
abstract It has a structure in which the organic resin is impregnated into the fiber body which fixed several semiconductor integrated circuits. The plurality of semiconductor integrated circuits are formed in openings formed in the structures, respectively, and have a step in the photoelectric conversion element and the side surface, and the width portion of the iron portion on the first surface side is larger than that of the second surface. A small translucent substrate, a semiconductor element layer formed on the second surface of the translucent substrate, and a colored translucent resin layer covering a part of the first surface and side surfaces of the translucent substrate are included. In the plurality of semiconductor integrated circuits, the colors of the colored translucent resin layers are different.
priorityDate 2008-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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