http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20090102692-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_eedd2a00c4d0ba56ecf05fb4b97592dd |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L75-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0353 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L1-08 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L75-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L1-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
filingDate | 2009-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_da1ac94bd4b2a0f0956ed03d835a39ac http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b4d596d86577182a20542357bc8211e0 |
publicationDate | 2009-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | KR-20090102692-A |
titleOfInvention | Thermosetting resin composition, cured product thereof and printed circuit board using the same |
abstract | The present invention provides a thermosetting resin composition suitable for forming a flexible film having excellent tag-free properties, adhesion to substrates, flex resistance, low warpage, solder heat resistance, electroless gold plating resistance, and electrical insulation properties, a cured product thereof, and the use thereof. Provide a printed wiring board.n n n In addition, a thermosetting resin composition contains a cellulose derivative (A) and a thermosetting compound (B). Preferably, it is preferable that the said cellulose derivative (A) is solvent soluble, and the glass transition temperature Tg of a cellulose derivative (A) is 100 degreeC or more. Preferably, the said thermosetting compound (B) is an epoxy resin (B1), More preferably, the said thermosetting compound (B) contains a carboxyl group-containing urethane resin (B2). Moreover, the hardened | cured material formed by hardening | curing the said thermosetting resin composition, More preferably, the hardened | cured material formed by hardening | curing a thermosetting resin composition on a tin-plated circuit, or the printed wiring board in which one part or all part of the surface was covered by the said hardened | cured material. Is also provided. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101493640-B1 |
priorityDate | 2008-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 161.