| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_696ca0ae93d5cf5a686273601361781f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29K2105-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29K2105-0008
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29K2105-0026
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29K2105-126
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29K2105-0044
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C66-7212
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C66-91935
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29K2309-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C66-91931
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29K2059-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29K2309-08 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J5-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J159-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J159-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C66-73116
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J159-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C66-73115
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C66-91411
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C66-71
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C65-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C65-40 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J5-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J159-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C65-40 |
| filingDate |
2007-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cfb18619e6711ba5c0b637f170e8f50d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bf244ca0be1c3bed5fd1db0181f2f567 |
| publicationDate |
2009-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20090094434-A |
| titleOfInvention |
Bonding method and structure of resin material comprising oxymethylene polymer |
| abstract |
In the method for bonding a resin material (X) containing an oxymethylene polymer (A) and a resin material (Y), the resin material (Y) satisfies the following conditions (1) and (2): Let oxymethylene type polymer composition (B) be made, or make the said resin material (Y) into resin material (X) or another kind of resin material, and between said resin material (Y) and resin material (X). It is a structure obtained by the bonding method of the resin material which heat-processes through an oxymethylene type polymer composition (B), and this bonding method. (1) The oxymethylene polymer composition (B) has a lower melting point than the oxymethylene polymer (A) and the melting point difference is less than 5 ° C. (2) 50% or more of the peak area determined from the peak representing the molten state of the oxymethylene polymer composition (B) measured by DSC is present in a temperature range of 5 ° C. or more lower than the peak temperature of the oxymethylene polymer (A) do. |
| priorityDate |
2006-12-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |