| abstract |
An object of this invention is to provide the adhesive sheet which can satisfy the heat resistance and moisture resistance which can fill the unevenness | corrugation, such as the wiring of a board | substrate and the wire laid in a semiconductor chip, and does not produce resin fluff at the time of dicing. Adhesive sheet of the present invention, the weight-average molecular weight containing a crosslinkable functional group is 100,000 or more and Tg is -50 to 50 ° C. High molecular weight component 15 to 40% by weight and thermosetting component mainly composed of epoxy resin 60 to 85 It contains 100 weight part of resin containing a weight%, and 40-180 weight part of fillers, It is characterized by the thickness of 10-250 micrometers.n n n n Adhesive Sheet, Dicing |