Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_33c922e05f6133b7d72dbb849d77487d |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32139 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K13-04 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K13-00 |
filingDate |
2008-02-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_88576c0d43518a0622a133a6ee95c592 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_406991ee9ccbd38302baaea6d2657341 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1ca8383425b1fe77487ce198d4da2f74 |
publicationDate |
2009-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
KR-20090089103-A |
titleOfInvention |
Formation method of metal wiring and etching liquid composition used in this method |
abstract |
The present invention relates to a method of forming a metal wiring and an etchant composition used in the method. Specifically, the present invention introduces a photomask in consideration of the occurrence of losses in the etching process performed during the formation of the metal wiring, so that even if the etching liquid composition containing no corrosion inhibitor is used, the etching characteristics such as tapered profile and tail length are excellent. It is also economically superior. |
priorityDate |
2008-02-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |