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filingDate 2008-02-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_88576c0d43518a0622a133a6ee95c592
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publicationDate 2009-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20090089103-A
titleOfInvention Formation method of metal wiring and etching liquid composition used in this method
abstract The present invention relates to a method of forming a metal wiring and an etchant composition used in the method. Specifically, the present invention introduces a photomask in consideration of the occurrence of losses in the etching process performed during the formation of the metal wiring, so that even if the etching liquid composition containing no corrosion inhibitor is used, the etching characteristics such as tapered profile and tail length are excellent. It is also economically superior.
priorityDate 2008-02-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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