| abstract |
A plating material having a seed layer formed with a thin and uniform film thickness capable of forming ultra fine wiring by electroless plating, and further eliminating the trouble of forming two layers of a barrier layer and a catalyst metal layer before forming a seed layer. Plating material which can be made, and the manufacturing method of this plating material.n n n On the substrate, an alloy thin film of a metal (A) having a catalytic activity of electroless plating, a metal ion contained in the electroless plating solution, and a metal (B) capable of substitution plating is formed, on which an electroless A plating material in which a metal thin film is formed by substitution and reduction plating, wherein an alloy thin film of the catalytically active metal (A) and the substitution-platable metal (B) contains the metal (A) at least 5 atomic% and at most 40 atomic atoms. A plating material having a composition of% or less, wherein the metal thin film formed by the electroless substitution and reduction plating is a metal thin film having a thickness of 10 nm or less and a resistivity of 10 μΩ · cm or less. It is preferable that the said metal (B) has a barrier function with respect to the metal of a metal thin film. |