| abstract |
An object of the present invention is to provide a semiconductor device in which appearance defects such as cracking, cracking, and cracking due to external stress are reduced. Moreover, it is one of the subjects to improve the manufacturing yield of a thin semiconductor device.n n n It has a plurality of semiconductor integrated circuits mounted on the interposer. The plurality of semiconductor integrated circuits each have a photoelectric conversion element, a transmissive substrate having a step on the side, and a width dimension having a smaller front portion facing one side than the step, and a side of the translucent substrate. The semiconductor element layer containing a photoelectric conversion element, and the colored translucent resin layer which covers a part of the other surface and side surface of a translucent board | substrate are included. In the plurality of semiconductor integrated circuits, the colors of the colored translucent resin layers are different. |