http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20090080514-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5283 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76847 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5226 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53295 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53223 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53238 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28 |
| filingDate | 2007-09-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b8e560c40bbafa586fe44e7ca256eb9c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9c2d5006ae4630ee2fd8b648a32cc818 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b52aeec3852612115603ad494e7a9b28 |
| publicationDate | 2009-07-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20090080514-A |
| titleOfInvention | Interconnect structure with improved electromigration reliability and manufacturing method |
| abstract | There is provided an interconnect structure with improved electromigration (EM) reliability. The interconnect structure according to the present invention is at least partially integrated with the EM resistant liner 66 within the metal interconnect to prevent the open circuit causing the EM failure. In one embodiment, a “U-shaped” EM anti-liner 66 is provided, which is adjacent to the diffusion boundary separating conductive material 64, 68 from dielectric material 54B. In another embodiment, there is a space between the “U-shaped” EM prevention liner and the diffusion boundary. In yet another embodiment, a horizontal EM resistant liner adjacent to the diffusion boundary is provided. In yet another embodiment, there is a space between the horizontal EM liner and the diffusion boundary. |
| priorityDate | 2006-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 24.