http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20090080226-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6f932d94618d9b875e401457b33e9761 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D11-0047 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D3-0073 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-423 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-425 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-422 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-265 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-426 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-32 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-34 |
| filingDate | 2008-01-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d82ff963c344a550f56f3ffc71fba10a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_82760315abcaa77a965475b72b585d21 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5efa6365927553b8dc7a2ba2d6fe81c6 |
| publicationDate | 2009-07-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20090080226-A |
| titleOfInvention | Stripping solution composition for removing photoresist residue and peeling method using the same |
| abstract | The present invention provides (A) an organic sulfonic acid compound, (B) glycolic acid, gluconic acid, citric acid and one or two or more aliphatic hydroxycarboxylic acid compounds selected from the group comprising salts thereof, (C) a water-soluble organic solvent, (D) fluorine compounds, and (E) A water-containing, amine-free composition for removing a photoresist residue, and a peeling method using the same. According to the present invention, in a manufacturing process of a semiconductor device and a flat panel display device, for the separation of photoresist residues including hardened and / or altered photoresist that may occur during an ashing process, a batch method or a single sheet method, A peeling liquid composition for removing a photoresist residue, which can be easily removed by a deposition method or a spraying method, and which has an excellent corrosion protection effect on a lower metal film and an insulating film exposed to the peeling liquid composition, and a peeling method using the same are provided. |
| priorityDate | 2008-01-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 141.