| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_268be9afa00cf55b5aa72b1612151ecb |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24917
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1653
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31678
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-405
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-121
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-38 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B05D3-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-387
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B05D5-067
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-165
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-2086 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B05D3-10 |
| filingDate |
2007-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_67b458ac2b27d4e8e1c944be104f1664
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cb9ac57b31d5a4a53ee03b1d1dd70aa0 |
| publicationDate |
2009-07-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20090079913-A |
| titleOfInvention |
Method for producing a substrate with a metal film, Substrate with a metal film, Method for producing a metal pattern material, Metal pattern material |
| abstract |
It has a metal film excellent in adhesiveness with a board | substrate, and provides the board | substrate with a metal film with low temperature and humidity dependence, and its manufacturing method. A metal pattern material having a metal pattern excellent in adhesion with a substrate, low in temperature and humidity dependency, and excellent in insulation reliability in a metal pattern non-forming region, and a method of manufacturing the same. (a1) forming a polymer layer comprising a polymer having a multidentate coordinating nonfunctional group which forms an interaction with a plating catalyst or a precursor thereof on the substrate, and which is directly chemically bonded to the substrate; (a2) the polymer Providing a multidentate-coordinated plating catalyst or a precursor thereof to the layer, and (a4) a step of plating the multidentate-coordinated plating catalyst or a precursor thereof, or (a2) the following step (a3) It is a manufacturing method of the board | substrate with a metal film characterized by having. (a3) A step in which the polymer layer contains a metal different from the multidentate plating catalyst or a precursor thereof. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20160141716-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101424225-B1 |
| priorityDate |
2006-10-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |