| abstract |
The epoxy resin composition for semiconductor encapsulation of the present invention is an epoxy resin, a hardener, talc, calcined clay, silicate such as unbaked clay, mica, glass, oxides such as titanium oxide, alumina, silica, fused silica, aluminum hydroxide and magnesium hydroxide. And at least one inorganic filler selected from hydroxides such as calcium hydroxide and a pH buffer having a pH buffer region at pH 4-8. Moreover, the semiconductor device of this invention is a hardened | cured material of the epoxy resin composition for semiconductor sealing described above, Comprising: A semiconductor element is sealed, It is characterized by the above-mentioned. |