http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20090069231-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_58d747a758244f04750caa191d6bb879 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-16 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-52 |
| filingDate | 2008-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_386b2dc5cd68b306d14228dfa63b2db9 |
| publicationDate | 2009-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20090069231-A |
| titleOfInvention | Substituted gold plating solution for copper and gold plating method using the same |
| abstract | Provided is a non-cyanide-substituted gold plating solution capable of forming a uniform gold film directly on a copper base.n n n A substituted electroless gold plating solution for copper holding containing 0.5 to 10 g / L of gold sulfite salt at a gold ion concentration and 10 to 150 g / L of water-soluble aminocarboxylic acid compound, characterized in that it does not contain sulfite other than gold sulfite salt. Substituted electroless gold plating solution for copper. The water-soluble aminocarboxylic acid compound contributes to the stabilization of sulfite complexes and acts as a complexing agent of metal impurities. Therefore, the gold plating solution of the present invention exhibits high liquid stability by suppressing self decomposition in the plating solution of the sulfite salt without including sulfite. |
| priorityDate | 2007-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 39.