| abstract |
In a soldering method for soldering an electronic device comprising a solder lead terminal and a palladium or palladium alloy layer formed on a surface of the electronic device onto a printed circuit board comprising a solder land and plated through holes, tin and zinc as main components The solder layer containing is formed on the surface of the land through hole by HAL processing. The lead terminal is inserted into the through hole and mounted. The printed circuit board supplies solder to the lands and through-holes by contacting the fractional flow of solder containing tin and zinc as main components.n n n n Solder Land, Through Hole, Printed Circuit Board, Palladium Alloy Layer, Solder Lead Terminals, HAL Treatment |