http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20090041858-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_717c792fca7cc9c290c9db33e8fe078b |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-00 |
| filingDate | 2007-10-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_da22cfa3a07df69aa9e49f3d3cdd9167 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_da9cf11bc8032adc3ea0b809f5ab1292 |
| publicationDate | 2009-04-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20090041858-A |
| titleOfInvention | Substrate manufacturing method with pattern |
| abstract | Disclosed is a method of manufacturing a substrate on which a pattern is formed. In the method of manufacturing a substrate having a pattern according to the present invention, a first binder pattern having a selective bonding force is formed at a position where an oxide bead pattern is to be formed on the substrate, and a bonding force with the first binder is greater than that with the substrate. Binary binder is coated on the oxide beads. The oxide binder coated with the second binder is then applied onto the substrate to form oxide beads coated with the second binder on the first binder pattern, and the substrate is heat treated. In another method of manufacturing a substrate on which a pattern is formed according to the present invention, a solution in which oxide beads are dispersed is prepared, a pattern is formed on a substrate, and a temporary structure is installed above the substrate so that microchannels are formed on the substrate. Then, a solution in which the oxide beads are dispersed is injected into the microchannel to fix the oxide beads on the substrate, and the substrate is heat treated. According to the present invention, inexpensive oxide beads can be patterned on a substrate in a desired shape, thereby preventing damage to the substrate during dry etching, and there is no problem of lowering the yield of the device because there is no etching process. Is increased. In addition, there is no need for expensive equipment investment for dry etching, so it is economically advantageous and has high productivity to manufacture a large amount of substrate in a short time. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101126301-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20180109164-A |
| priorityDate | 2007-10-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 17.