| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d9cb217f83556ce2a418344c2d485415 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24917
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-426
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0346
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0175
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31721 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-38 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
| filingDate |
2005-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0f6ea51600d7434671ebdd74588a5d65
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bac2f19705dc36738eaafc71fe4390a6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b012510dfb53ae29073c6bde253386d2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7a426a5a2bed30320892b3b030712c17 |
| publicationDate |
2009-04-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20090038039-A |
| titleOfInvention |
Polyimide-Metal Laminates and Polyimide Circuit Boards |
| abstract |
The present invention provides a polyimide-metal laminate obtained by forming a metal conductive layer on at least a ceramic-modified or pseudo-ceramic-modified polyimide film on a surface by a wet plating process capable of achieving metal plating on a ceramic. Provide a sieve. Thereby, a polyimide-metal laminate and a polyimide circuit board which exhibit satisfactory cohesion in the wet plating step, maintain substantial cohesion even after high temperature aging treatment, and exhibit satisfactory electrical insulation reliability can be obtained. |
| priorityDate |
2004-01-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |