| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4d72711e97d894c55af805c9de2053ab |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53228
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-423
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G08B5-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G08B25-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G08B17-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G08B3-1033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-48 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-532
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-321 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-48 |
| filingDate |
2009-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8297db5dae758078e60c605c28b339e6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0c02a301e426dd20539fd63590376231
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_71eec3538d3f8a70fe3567f5a95c2e40 |
| publicationDate |
2009-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20090031539-A |
| titleOfInvention |
Electrolyte |
| abstract |
The present invention provides an electrolyte for copper electroplating that provides improved filling of small features while reducing overplating. The present invention also provides a method of plating a substrate such as an electronic device using such an electrolyte. |
| priorityDate |
2000-10-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |