http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20090025343-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8cf8d77ac0eff1767b22d2fb9445b64d |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B05D2401-90 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02203 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B05D5-005 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02126 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76814 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B05D1-185 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B82Y30-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B82Y40-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76826 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3105 |
| filingDate | 2007-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2e3024f80a4d8db78b8acdc5d8856662 |
| publicationDate | 2009-03-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20090025343-A |
| titleOfInvention | Repair and restore the strength of low-k dielectric materials damaged by etching |
| abstract | The process of repairing a plasma etched low-k dielectric material with surface-bonded silanol groups involves exposing at least one side of the dielectric material to (a) a catalyst to form hydrogen bonds between the catalyst and the surface-bonded silanol groups. To form a catalyst intermediate that reacts with the silane capping agent to form a surface-bonded silane compound, or (b) is exposed to a solution comprising a supercritical solvent, a catalyst, and a silane capping agent to provide a catalyst and surface- Forming a hydrogen bond between the bonded silanol groups to obtain a catalyst intermediate that reacts with the silane capping agent to form a surface-bonded silane compound. Horizontal networks can be formed between adjacent surface-bonded silane compounds. The dielectric material may also be treated with organic acids to form silanol groups that can be condensed through heating to promote hydrolysis reactions with alkoxy groups on surface-bonded silane compounds to remove byproduct water. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20160030856-A |
| priorityDate | 2006-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 62.