| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_cd7571c3ca18e1bd302b88246e1e381b |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J125-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J125-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-08 |
| filingDate |
2007-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8aa1e811f0c23dcdb7ccd95ec419dc85
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cc9d57a2211e365a1cce60b24f6dc101
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_923e6adf383cb812113513d19e54fad8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4db1addc79a114b993b574b8570bb607
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_57bf7ee611a1162eeb5dbd4024f4dd6b |
| publicationDate |
2009-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20090022072-A |
| titleOfInvention |
Adhesive paste composition for semiconductor device manufacturing |
| abstract |
The present invention relates to an adhesive paste composition for manufacturing a semiconductor device. The present invention is characterized in that it comprises a plasticizer which is a single substance or a mixture of two or more selected from styrene, acrylate, and novolac, wherein the material selected from the plasticizer is a hydrogen group (-H), It is preferable that the material combines one or two or more functional groups selected from an amine group (-NH 3 ) and a phosphate group. By using the plasticizer according to the present invention, it is possible to provide an adhesive paste composition for manufacturing a semiconductor device having physical properties that are included in the composition to improve the printability of the adhesive and the content thereof does not weaken the adhesive strength of the adhesive. |
| priorityDate |
2007-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |