| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_43e9bc481473b7735d51aacc3e34fbba |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-3025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-06727 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-067
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-073
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-06711
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-07 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-073 |
| filingDate |
2007-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ddd8b1ff1a1d9b210a444caa82dbf3c6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dd1c9b6297274c3e7cb8f6ddf1039ec7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a69e772b55e4deb53e1dad2f5a9b29f4 |
| publicationDate |
2009-02-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20090018715-A |
| titleOfInvention |
AC coupled parametric test probe |
| abstract |
The probe for contacting and testing ICs on a semiconductor device includes a dielectric insulator material tip. Dielectric tips, unlike metal probe tips, do not contaminate the probed surface. No additional contact scrub is needed and the signals are capacitively or inductively coupled to the IC from the probe tip. Testing can be performed during the initial fabrication steps of the wafer without the need to provide a metallization layer on the wafer to form bond pads. The test can be performed by inductively coupling the AC signal to the probe tip, which is augmented by including the magnetic material in the dielectric probe tip. Using the AC test signal allows the IC to be tested without requiring separate power and ground connections. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20190034687-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015194882-A1 |
| priorityDate |
2006-06-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |