| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4d72711e97d894c55af805c9de2053ab |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 |
| filingDate |
2008-08-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d4273282efd3b3f20dc0530b53f48501
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_88a1f822021fdb4b26c068babe486008 |
| publicationDate |
2009-02-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20090016420-A |
| titleOfInvention |
Copper Plating Bath Formulation |
| abstract |
Provided is a copper plating solution composition which deposits a copper plating film having a uniform, smooth and excellent appearance even when the formed copper plating film is relatively thin. The copper plating solution composition contains chlorine ions and bromide ions in specific volumes. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20150056655-A |
| priorityDate |
2007-08-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |