http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20090014165-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5d4ada69388e0a1b68daaf536597c732 |
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31663 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24479 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F220-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01J31-146 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-55 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F4-52 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F220-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G77-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B01J31-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F4-52 |
filingDate | 2007-02-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_db9eee2a05b1e3c213316e597ed47046 |
publicationDate | 2009-02-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | KR-20090014165-A |
titleOfInvention | Borane catalyst complexes with amide functional polymers and curable compositions prepared therefrom |
abstract | The borane catalyst complex with the amide functional polymer has a borane portion of the complex that may contain one or more silicon atoms. The catalyst complex may be used as a component in a curable composition containing (i) a catalyst complex, (ii) free radically polymerizable monomers, oligomers or polymers, and optionally (iii) a decomplexing agent. The curable composition may contain various other optional components as well as components capable of generating gas. These curable compositions include rubbers, tapes, adhesives, protective coatings, thin films, thermoplastic integral molded parts, thermosetting integral molded parts, sealants, foaming agents, gaskets, seals, o-rings, pressure sensitive adhesives, die attach adhesives, lead sealants (lid sealant), encapsulating agent, potting compound, conformal coating, and electronic components. The composition may also be used in composite products, such as connectors, diving masks or other integrally bonded parts, wherein the substrate is coated with or bonded with the composition and cured. |
priorityDate | 2006-05-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 26.