| abstract |
Disclosed is a method of manufacturing an LED light emitting device. The method contacts the LED with a first encapsulant which is a silicone gel, silicone rubber, silicone liquid, organosiloxane, polysiloxane, polyimide, polyphosphazene, sol-gel composition, or first photopolymerizable composition, followed by a first encapsulation. Contacting the ash with the second photopolymerizable composition to form a multilayer encapsulant in contact with the LED. Each photopolymerizable composition comprises a silicon-containing resin and a metal-containing catalyst comprising silicon-bonded hydrogen and aliphatic unsaturations. Actinic radiation having a wavelength of 700 nm or less is applied to initiate hydrosilylation in the silicon-containing resin. |