| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9ec030fc062b270c25327af9127bed3a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-94
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01046
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-10 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-50 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-50 |
| filingDate |
2008-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4f14b2657a43f022c5795c5d525de357
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d9cb044997291b0e1a619e627314ab21
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_17ff15ea2472cadeea0da28d750bab3c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_067c84e3222d79a474b23162c919c652
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_515d16e85576f05546b7db30463ad4a2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7d215d6697da933671638d919759b4b7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0fd1772f7b857650c2ddc1f82db09fe7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_64147a0dcbe3174aa885c02be38d543c |
| publicationDate |
2009-01-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20090008146-A |
| titleOfInvention |
How to form solder bumps |
| abstract |
A solder bump forming method for forming solder bumps by reflowing conductive balls mounted on a plurality of pads, comprising: a metal film forming step of forming a metal film capable of chemically reacting with a tackifying compound on a pad and a tackifying compound An organic adhesive layer forming step of chemically reacting a solution and a metal film to form an organic adhesive layer on the metal film, and supplying conductive balls on a pad on which the organic adhesive layer is formed, thereby placing conductive balls on the pad through the metal film. Steps. |
| priorityDate |
2007-07-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |