| abstract |
assignmentn n n n Provided are an electronic module and a method of manufacturing the same, which can increase the mounting area of an electronic component and can sufficiently secure connection strength between the ground electrode and the conductive shield by suppressing a poor connection between the ground electrode and the metal shield.n n n n Resolutionn n n n In the electronic module 100, an electronic component 60 is mounted on a multilayer substrate 1 having a semiconductor device 30 or the like embedded therein, and these are sealed with a sealing layer 110 such as an epoxy resin, and further, a sealing layer 110. ) And the multilayer substrate 1 are covered with the metal shield 120. The multilayer board 1 and the metal shield 120 are electrically connected by the ground electrode GN exposed by cutting a part of the multilayer board 1. |