| abstract |
The present invention relates to a conductive wire, a spooler, a wire bonder, a lead frame and a lead frame fixing device for semiconductor packaging, and in particular, a conductive wire having a conductive means for preventing oxidation of the lead wire and the lead frame used in the semiconductor packaging process. A wire, a spooler, a wire bonder, a lead frame, and a lead frame fixing device.n n n The conductive wire according to the present invention is a conductive wire for electrically connecting a semiconductor die and a lead frame or a semiconductor die and a substrate in a semiconductor package, wherein the conductive wire is electrically bonded with the conductive wire and tends to be relatively ionized than the wire metal of the conductive wire. It is composed of large anticorrosive metals. |