| abstract |
To clean the lead-free solder flux adhering to the object to be cleaned, the cleaning composition having low environmental load and substantially satisfying in terms of odor, flammability, etc. Provided are a cleaning agent capable of more effectively removing lead-free solder flux used and a method of removing the composition (and the cleaning agent). (A) Polyoxyalkylene phosphate ester type surfactant, (B) metal chelating agent, and (C) the lead-free solder flux removal detergent composition containing the organic solvent, General formula (7): M a H b Carbonate represented by (CO 3 ) c (wherein a represents an integer of 1 or 2, b represents an integer of 0 to 2, c represents an integer of 1 or 2, and M represents a volatile organic base, respectively.) Lead-free solder flux removal cleaning agent comprising a. |