http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20080112126-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fcc0b66123940d1b32783569ebfa2d45 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1409 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B82Y99-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B82Y10-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00 |
| filingDate | 2008-06-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_185a59569550cc953146c98b8101ca54 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_099904b8028bc7bfbacb479230eba164 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_db43236b2db3955149a5f12aa7de93a1 |
| publicationDate | 2008-12-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20080112126-A |
| titleOfInvention | Sets for the preparation of aqueous dispersions for chemical mechanical polishing, methods for producing aqueous dispersions for chemical mechanical polishing, aqueous dispersions for chemical mechanical polishing and methods for polishing chemical machinery |
| abstract | In the planarization process of the to-be-polished surface by chemical mechanical polishing, the manufacturing method of the chemical mechanical polishing aqueous dispersion which can suppress surface defects, such as dishing, erosion, a scratch, and a swell, and long-term storage stability also in a concentrated state. An excellent chemical mechanical polishing aqueous dispersion production set is provided.n n n The set for preparing a chemical mechanical polishing aqueous dispersion according to the present invention comprises a colloidal silica and a basic compound having an average primary particle diameter of 15 nm to 40 nm and a first composition having a pH of 8 to 11 and a poly (meth). The 2nd composition which has the pH of 1-5 with acrylic acid and the organic acid which has two or more other carbonyl groups is provided. |
| priorityDate | 2007-06-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 81.