http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20080111283-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d6a823767b778997fdc277d91c90a9fb |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2889 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-0408 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2601 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-067 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66 |
| filingDate | 2007-06-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_331d1fe10c1e214fbfb7d7e1fdf62b82 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c80c40b724f5a7566ebdfebe546594a8 |
| publicationDate | 2008-12-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20080111283-A |
| titleOfInvention | Flexible interposer and manufacturing method of the flexible interposer |
| abstract | The present invention relates to a flexible interposer and a method of manufacturing the flexible interposer, wherein a test pad for contacting a pad in the form of a plate in which a test terminal is placed on an upper surface of the socket, rather than the shape of an inserted socket for inspecting a completed semiconductor. Was developed to enable accurate inspection and to facilitate manufacturing;n n n A test board having a plurality of contact pads for electrical contact on an upper surface thereof, a semiconductor device package having a plurality of protruding leads formed by electrical contact on a bottom surface thereof, and a contact pad of the test board A test pad electrically connecting leads of the semiconductor device package;n n n A first horizontal portion contacting with the contact pads, a second horizontal portion contacting with the lead and the first horizontal portion and a second horizontal portion integrally connected to each other, and have a curved shape to have elasticity at a vertical pressure A plurality of connecting pins formed of curved portions formed such that the curved lines are contracted by pressure;n n n A flexible interposer comprising a plurality of connection pins formed of a plate filled with a material having a property of an insulating elastic body including portions except the bottom surface of the first horizontal portion and the top surface of the second horizontal portion; Andn n n A cut plate made of a thin metal conductor cut to a certain size is cut into a first horizontal portion corresponding to a contact pad formed for electrical contact with an upper surface of a test board, and a protruding lead formed on a bottom surface of a semiconductor device package. Forming to connect the corresponding second horizontal portion and the first horizontal portion and the second horizontal portion integrally, but bent to include a curved portion formed in the form of a curve to have elasticity in the vertical pressure and the curve is contracted by the pressure Process;n n n A molding process of arranging the bent discs in a predetermined form according to a purpose and then filling an empty space except the bottom of the first horizontal part and the top of the second horizontal part with an insulating elastic body in a plate shape;n n n Finished silicon plate is cut at regular intervals to form the disc into a plurality of arranged connection pins, and a series of cutting and mold re-injection processes are performed continuously to refill the insulating elastomer in the space between the cuts. The present invention relates to a flexible interposer manufacturing method. |
| priorityDate | 2007-06-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5461123 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559541 |
Total number of triples: 20.