http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20080105459-A

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filingDate 2007-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_de5ff6bb5592b4cf93ce67ee70b7147a
publicationDate 2008-12-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20080105459-A
titleOfInvention Eco-friendly semiconductor polishing pad composition
abstract The present invention relates to a chemical mechanical polishing composition, and more particularly, because it does not use any solvents and substances harmful to the human body, it does not provide any hazard to workers and is an environmentally friendly product, and is physically applied to the polishing composition consisting of conventional colloidal silica sol. By filtering and recirculating, it can effectively reduce large particles of 3 ㎛ or more to prevent scratches on the surface of the wafer after polishing as well as to easily remove residual particles remaining on the surface after cleaning. It relates to an environment-friendly semiconductor polishing pad composition that can be effectively utilized.
priorityDate 2007-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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