| abstract |
The present invention provides a thermosetting resin composition having excellent low temperature curability, adhesiveness, flexibility, and electrical properties, a cured product of the composition, and a use thereof.n n n The thermosetting resin composition of this invention contains (A) thermosetting resin, Preferably a carboxyl group-containing polyurethane and (B) Polyfunctional aliphatic glycidyl ether compound whose total chlorine amount is less than 0.7 mass%. The hardened | cured material of a thermosetting resin composition is used as an insulation protective film, such as a printed circuit board, a flexible printed circuit board, and a chip-on film. |