| abstract |
The present invention provides a method of forming multiple layers by electroetching or electroplating a substrate. The seed layer is arranged on the substrate and the master electrode is applied. The master electrode has a patterned layer that forms multiple electrochemical cells with the substrate. Voltage is applied to etch the seed layer or to apply the plating material to the seed layer. Dielectric material 9 is arranged between the formed structures 8. The dielectric layer is planarized to expose the underside of the structure and another structure layer is formed over the first portion. Alternatively, the dielectric layer is applied to a thickness of two layers and the structure below is accessed by selective etching of the dielectric layer to selectively expose the top surface of the structure below. Multiple structural layers may also be formed in one step.n n n n Electro Etching, Seed Layer, Etching, Plating, Master Electrodes, Sputtering, Deposition |