http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20080100660-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_cd7571c3ca18e1bd302b88246e1e381b |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-351 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10253 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-58 |
| filingDate | 2007-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4db1addc79a114b993b574b8570bb607 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b9aec2bf37556d145c6b974224175625 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8aa1e811f0c23dcdb7ccd95ec419dc85 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cc9d57a2211e365a1cce60b24f6dc101 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_26aeb977b0bdfe16436fd64ee797833d |
| publicationDate | 2008-11-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20080100660-A |
| titleOfInvention | Dicing die adhesive film |
| abstract | The present invention relates to a dicing die adhesive film. In the dicing die adhesive film of the present invention, the dicing die adhesive film is laminated on the base material and the base material so as to be peeled off, the dicing die adhesive film, the die adhesive layer is a storage modulus at a temperature of 60 ℃ It is 1.0 * 10 < 6> -1.0 * 10 < 9> Pa, adhesive force in this temperature range is 5-300 gf, and melt viscosity in 140-150 degreeC temperature range is 500-5000 Pa second, It is characterized by the above-mentioned. According to the present invention, it is possible to sufficiently cover the wire bond located on the semiconductor chip during the semiconductor package process, and when two or more layers are stacked, they are interposed between dies and have excellent chip-to-chip insulation effects. |
| priorityDate | 2007-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 30.