Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f97f0fa258a008bf056ad04b7f380dda |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14618 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-146 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01T1-244 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-02002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-115 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14676 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-0203 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L31-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-146 |
filingDate |
2006-02-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1cc73b2cb40b45c1c2311da928c3371c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d07e5297e412727af826f8050090ef50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f7fe5294b1660e04de085e042f6764ba |
publicationDate |
2008-10-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
KR-20080094804-A |
titleOfInvention |
Radiation detector |
abstract |
In the radiation detector of the present invention, a portion of the semiconductor located at the connection portion of the common electrode to the lead wire is formed in a concave shape than other portions of the semiconductor within a range not reaching the radiation detection effective area. The insulating pedestal is disposed so as to fill the positions located at the connecting portions, the common electrode is formed so as to cover at least a part of the pedestal described above, and the lead wire is connected to the position located at the pedestal in the incident surface of the common electrode. Since it is formed as much as possible, the performance degradation due to connecting the lead wire to the common electrode can be avoided, and the problems of thermal strain stress and radiation attenuation can be avoided. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101318455-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8563940-B2 |
priorityDate |
2006-02-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |