http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20080092966-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1a34d7d2e0d09a58cb7bf4a04c81162e |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3011 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3735 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3737 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-24 |
| filingDate | 2007-01-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4787b7588f56b130c40d7809848b594c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ef280eafda5a10477c928132d60697ff http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dae645f720b1930a1d1b8e1a224a0dea |
| publicationDate | 2008-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20080092966-A |
| titleOfInvention | Thermal Interconnect and Interface Systems, Their Manufacturing Methods and Applications |
| abstract | The components and materials comprising heat transfer materials herein may include at least one heat spreader component, layer and / or film, at least one thermal interface material, and at least one in some intended embodiments, coupled with the metallic coating. Adhesive material. The heat spreader component includes an upper surface, a lower surface and at least one heat spreader material. The thermal interface material is deposited directly on at least one surface minimum portion of the heat spreader component. The method of forming a layered thermal interface material and a heat transfer material;n n n a) providing a heat spreader component comprising a top surface, a bottom surface and at least one heat spreader material; b) providing at least one thermal interface material deposited directly on the bottom surface of the heat spreader component; c) placing, applying or coating a metallic coating, film or layer on at least a portion of the bottom surface of the heat spreader component; And d) depositing, applying or coating the at least one thermal interface material on a portion of at least one surface of the heat spreader component;n n n It includes. A method of forming a thermal solution / package and / or IC package;n n n a) providing the heat transfer material described herein; b) providing at least one tacky component; c) providing at least one surface or substrate; d) combining at least one heat transfer material and / or material with at least one sticky component to form a sticky unit; e) coupling said tacky unit to said at least one surface or substrate to form a thermal package; And f) optionally coupling an additional layer or component to said thermal package;n n n It includes. |
| priorityDate | 2006-01-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 32.