| abstract |
(1) An epoxy resin composition comprising a tetramethylbisphenol F type epoxy resin, a curing agent, a filler, and a silane coupling agent, wherein the silane coupling agent comprises an aminosilane coupling agent having a primary amino group, or (2) An epoxy resin composition comprising a tetramethylbisphenol F type epoxy resin, a curing agent, and a filler, wherein the curing agent contains a specific phenol compound, or (3) an epoxy resin consisting of a tetramethylbisphenol F type epoxy resin, a curing agent, and a filler. As a composition, the epoxy resin composition whose filler is specific is very suitable for the sealing of an electronic circuit component because it is excellent in the reliability of peeling resistance, expansion characteristics, etc. at the time of reflow, and filling property at the time of shaping | molding. |