| abstract |
This invention contains (A) epoxy resin and (B) hardening | curing agent, (B) is represented by (C) following formula (I) as a hardening | curing agent, n is an integer of 1-10, m contains a compound of 1-10 It relates to the epoxy resin composition for sealing. This is an electronic component which is non-halogen and non-antimony and has a sealing flame retardant epoxy resin composition having excellent flame retardancy without deteriorating reliability such as formability, reflow resistance, moisture resistance, and high temperature anti-corrosion characteristics, and an element sealed thereby. A device can be provided.n n n <Formula I>n n n n n n n n In formula (I), R 1 is selected from a hydrogen atom and a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms, and R 2 is selected from a hydrogen atom and a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms. Selected) |