| abstract |
The present invention is other than [A] (a1) unsaturated carboxylic acid and / or unsaturated carboxylic anhydride, (a2) epoxy group and / or oxetanyl group-containing unsaturated compound, and (a3) component (a1) and component (a2) Provided is a radiation-sensitive resin composition containing a copolymer of an unsaturated compound, a [B] 1,2-quinonediazide compound, and a [C] [A] component and a siloxane oligomer containing a functional group crosslinked by heat. .n n n The present invention has a high radiation sensitivity, a radiation margin capable of easily forming a patterned thin film excellent in adhesion, having a developing margin which can still form a good pattern shape even if the optimum developing time is exceeded in the developing process. Resin composition. |