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publicationDate 2008-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20080061023-A
titleOfInvention Wiring Reliability Verification Method and Semiconductor Device Manufacturing Method
abstract Disclosed are a method for verifying wiring reliability and a method for manufacturing a semiconductor device capable of improving wiring reliability.n n n A method of manufacturing a semiconductor device includes forming an interlayer insulating film having via holes on a semiconductor substrate, forming a seed layer on the interlayer insulating film, and performing ammonia plasma treatment on the seed layer to produce a seed having a small surface roughness. Forming a layer and forming a copper interconnect in the via hole.
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